Guest Editorial: Special Issue on "Selected papers from ICASI 2021"

Liang-Wen Ji,
Kin-Tak Lam,
Sheng-Joue Young,
Siu-Tsen Shen,

Abstract


So far, the novel coronavirus pneumonia has been raging around the world for more than a year. The epidemic (COVID-19) has already spread, not only changing human behavior, but also significant changes in the operation of the enterprise. However, in the post epidemic era, there are many emerging applications and business opportunities, including zero contact economy, zero border manufacturing, zero distance innovation, zero burden health, zero pollution ecology, etc. Therefore, Taiwan should make advanced deployment, such as the layout of epidemic prevention technology, strengthening the value of wisdom, the transformation and upgrading of science and technology service industry, and enhancing the industry ecology. Novel coronavirus pneumonia is a major threat to the industry in 2020. Manufacturing industry has adopted digital technology to cope with the global COVID-19 epidemic crisis, especially artificial intelligence (AI), internet of things (IoT), edge computing and analytical technology. This special issue selected 4 papers from “7th IEEE International Conference on Applied System Innovation 2021 (IEEE ICASI 2021)”. This special issue provides a systematic overview and state-of-the-art research in Internet Technology, Computing, IoT and Computer Engineering Technology, with a special focus on artificial intelligence (AI), internet of things (IoT), edge computing and Blockchain technologies, and will outline new developments in fundamental, approaches, methodologies, software systems, and applications in these areas. The aim is to discover new scientific knowledge relevant to IT-based Intelligent Electrical/Mechanical Systems, Mechanics, Human-Computer Interaction (HCI) and Design Innovations.

Keywords


nan

Citation Format:
Liang-Wen Ji, Kin-Tak Lam, Sheng-Joue Young, Siu-Tsen Shen, "Guest Editorial: Special Issue on "Selected papers from ICASI 2021"," Journal of Internet Technology, vol. 23, no. 4 , pp. 837-838, Jul. 2022.

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